฿9,300.00
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Product Category · Electronics & SemiconductorGas Generator Systems
Gas Generator Systems
N₂ & O₂ for Electronics & Semiconductor
A nitrogen gas generation system is a critical utility for semiconductor and electronics manufacturing facilities. Our on-site PSA nitrogen generators deliver up to 99.999% purity for wafer fabrication, PCB soldering, device packaging, and cleanroom atmosphere control applications. By producing nitrogen on-site, manufacturers can reduce dependence on gas cylinder supply, improve supply reliability, and maintain consistent gas quality while lowering operating costs. We also provide industrial oxygen generation systems for semiconductor and electronics processes requiring controlled oxygen environments.
✓ 99.999% N₂ Purity ✓ SEMI F78 Compatible ✓ On-Site Generation ✓ Continuous Purity Monitor
System Overview
Key Specifications
N₂ Purity99.999% (5N) — 10 ppm O₂ or below
TechnologyPressure Swing Adsorption (PSA)
Purity Range95% to 99.999% — selectable per application
MonitoringContinuous O₂ analyser + alarm relay
ComplianceSEMI F78 compatible systems
✓ 99.999% N₂ Achievable ✓ Continuous O₂ Monitor ✓ SEMI F78 Compatible ✓ On-Site Generation ✓ 60-80% Cost Saving
Industry Overview
Why On-Site Gas Generation Is the Foundation of Semiconductor & Electronics Gas Supply
Nitrogen is the most widely consumed industrial gas in semiconductor manufacturing. A high purity nitrogen generator for wafer fabrication must supply nitrogen continuously at 99.999% purity to purge oxygen from lithography tool stages, blanket oxidation-sensitive surfaces during deposition, provide inert atmosphere in wire bonding and device packaging, and maintain low-humidity environments for moisture-sensitive device storage. Traditional cylinder or liquid nitrogen delivery cannot meet these volumes reliably or economically.
An on-site nitrogen generation system for microelectronics using PSA technology produces nitrogen continuously from compressed air at the same purity as delivered gas — at a fraction of the operating cost. Once installed, nitrogen is produced at the marginal cost of electricity, with typical payback periods of 12–24 months in high-consumption electronics facilities. The nitrogen supply system for cleanroom environment eliminates all external supply risk: as long as the compressor operates, nitrogen is available at specification regardless of external logistics.
Semiconductor-grade systems include continuous oxygen analysers that verify purity in real time — triggering alarms and production diversions if purity deviates below specification, providing the documented gas quality evidence required for process gas qualification in semiconductor manufacturing environments.
- PSA nitrogen — 95% to 99.999% purity range
- Continuous oxygen analyser — alarm on specification deviation
- Eliminates liquid nitrogen delivery risk and cryogenic handling
- Payback typically 12–24 months in high-consumption facilities
- Scalable capacity modules as demand grows
- Full commissioning documentation for process gas qualification
Why It MattersWhy On-Site Gas Generation Is Critical to
Why On-Site Gas Generation Is Critical to
Electronics & Semiconductor Manufacturing
01🏭Supply Security
Eliminate Supply Chain Risk in Gas-Intensive Fabs
Semiconductor fabs and electronics production lines consume enormous quantities of nitrogen continuously. Dependency on delivered liquid nitrogen creates a critical supply chain vulnerability — transport disruptions, supplier failures or delivery scheduling conflicts can interrupt nitrogen supply and force production shutdown of all N₂-dependent tools simultaneously. A gas generation system for chip manufacturing eliminates this risk by generating nitrogen on-site from compressed air, making the gas supply completely independent of external logistics.
Fab Impact
On-site generation from compressed air means nitrogen is available at specification 24/7, as long as the compressor operates — regardless of delivery schedules, supplier capacity or transport disruptions.
02💰Cost Reduction
60–80% Gas Cost Reduction vs Delivered Supply
In high-volume semiconductor facilities and PCB assembly lines consuming thousands of cubic metres of nitrogen per day, on-site generation reduces gas supply cost to 20–40% of equivalent delivered liquid nitrogen cost. After the system capital cost payback — typically 12–24 months — all nitrogen is produced at the marginal cost of electricity with no delivery fees, cylinder rental or cryogenic liquid handling costs. This is a fundamental economic argument for every industrial gas solution for semiconductor fabrication.
Cost Impact
For a facility consuming 5,000 m³/day of nitrogen, on-site generation typically saves 2–4 million THB annually versus delivered gas — more than covering annual system maintenance costs.
03📊Purity Verification
Continuously Verified Semiconductor-Grade Purity
On-site nitrogen generators with continuous oxygen analysers verify gas purity in real time and trigger production alarms if oxygen concentration exceeds specification limits. This continuous verification provides documented evidence of gas quality for every production period — supporting process gas qualification requirements in semiconductor manufacturing. Unlike delivered cylinder or liquid nitrogen, where purity is certified at the source but cannot be verified at point-of-use, on-site generation with inline analysers confirms purity at the actual point where gas enters the process.
Compliance Impact
Continuous purity data logging supports semiconductor fab SPC systems and provides the documentation required for periodic process gas system qualification reviews under SEMI F78.
Product Range
On-Site Gas Generation Systems for Semiconductor & Electronics Manufacturing
Our semiconductor gas generation range covers both nitrogen and oxygen production for all electronics manufacturing applications — from wafer fabrication to PCB assembly and display manufacturing.
⭐ Primary Solution 🧪
On-Site PSA Nitrogen Generator
The primary nitrogen gas generator for semiconductor industry and electronics manufacturing — PSA generators producing 95% to 99.999% purity N₂ from compressed air, with continuous O₂ analyser, alarm relay and full SEMI F78 compatible documentation package.
Technical Specifications
| Technology | Pressure Swing Adsorption (PSA) — dual-tower carbon molecular sieve |
| Purity | 95% to 99.999% N₂ — selectable at commissioning |
| O₂ Content | <10 ppm @ 99.999% (5N) grade |
| Monitoring | Continuous O₂ analyser with alarm relay and data logging |
| Compliance | SEMI F78 compatible; commissioning documentation included |
Applications
Oxygen Applications ⚗️
On-Site PSA Oxygen Generator
An oxygen gas system for microchip production using VPSA or PSA technology — on-site oxygen generators for semiconductor applications requiring controlled O₂ atmosphere, including thermal oxidation furnaces, ozone generation for photoresist stripping and semiconductor wet cleaning processes.
Technical Specifications
| Technology | VPSA (Vacuum Pressure Swing Adsorption) or PSA |
| Purity | Up to 93% O₂ — standard VPSA output |
| Best For | Thermal oxidation, ozone generation, wet cleaning |
| Monitoring | Continuous O₂ purity verification with alarm |
| Applications | Oxidation furnaces, ozone systems, UV/ozone strip |
Applications
Why Choose Us
Benefits of On-Site Gas Generation for Semiconductor Facilities
On-site nitrogen generation transforms semiconductor and electronics gas supply from a variable operating cost and supply risk into a fixed-cost, internally controlled utility — with documented purity verification included as standard.
01💰
60–80% Cost Reduction vs Delivered Gas
Once installed, on-site generators produce nitrogen at the marginal cost of electricity — typically 20–40% of equivalent delivered liquid nitrogen cost, with payback in 12–24 months at typical semiconductor and electronics facility consumption levels.
02🔄
Continuous 24/7 Uninterrupted Supply
On-site generation produces nitrogen 24/7 from compressed air — eliminating all delivery logistics, cryogenic liquid handling and supply chain vulnerability that can interrupt production in gas-dependent semiconductor and electronics manufacturing facilities.
03📊
Real-Time Purity Verification
Continuous oxygen analysers verify nitrogen purity at the point of use in real time with alarm relay — providing documented process gas quality data for semiconductor fab qualification requirements, not just supplier certificates at the point of production.
04⚡
Scalable Modular Capacity
Modular PSA systems can be expanded as nitrogen demand grows — adding generator modules without replacing the existing system, protecting capital investment as your semiconductor or electronics facility scales production capacity.
05🏭
Eliminate Cylinder & Cryogenic Hazards
Removing liquid nitrogen dewars and high-pressure cylinders from your production environment eliminates stored energy hazards, cold burn risks from cryogenic liquid and cylinder handling injuries — improving facility safety and eliminating cylinder management overhead.
06🔬
SEMI F78 Compatible Systems
Gas generation systems designed and documented to SEMI F78 specifications for semiconductor process gas supply — compatible with fab gas distribution infrastructure, point-of-use purity monitoring integration and process gas qualification audit requirements.
Applications
Gas Generation Applications in Semiconductor & Electronics Manufacturing
Nitrogen is consumed throughout the semiconductor and electronics manufacturing process — from front-end wafer processing through back-end assembly, test and display manufacturing — with each application requiring a specific purity grade.
💡
Lithography Tool Purging
Front End of Line
N₂ purge for projection lens environment and wafer stage atmosphere — oxygen in the lens environment causes lens absorption changes that shift pattern placement; even ppm-level O₂ is unacceptable at advanced nodes
SEMI S2 — 99.99–99.999% N₂🔥
Wave & Reflow Soldering
PCB Assembly
Nitrogen generator for PCB soldering process — N₂ atmosphere prevents solder and component lead oxidation, reducing defects including solder balls, bridging and cold joints, improving first-pass yield and reducing rework costs significantly
IPC J-STD — 99.5–99.99% N₂⚙️
Wire Bonding Atmosphere
IC Packaging
N₂ or forming gas (N₂/H₂) atmosphere for wire bonding — prevents oxidation of bond pad surfaces and gold/copper wire that would reduce bond strength and long-term reliability of finished semiconductor packages
JEDEC — 99.99% N₂📦
Device Packaging & MSD Storage
Final Packaging
N₂ backfill for moisture-sensitive device (MSD) packaging and N₂-purged dry storage cabinets — prevents component lead and termination oxidation and protects MSD components from moisture absorption between manufacture and assembly
J-STD-033 — 99.9% N₂🔬
Wafer Storage & FOUP Transport
Fab Logistics
N₂ atmosphere in FOUPs and SMIF pods during wafer storage and transport between process tools — prevents native oxide growth and surface contamination on wafer surfaces between process steps, particularly critical for time-sensitive gate oxide processes
SEMI E47 — 99.99% N₂⚗️
Thermal Oxidation & Furnace Processes
Oxidation Furnace
O₂ for controlled thermal oxidation to grow gate oxide and field oxide layers, and N₂ as carrier/purge gas in diffusion and annealing furnaces — both gases required in matched-flow controlled proportions for process repeatability
Process specification — 93%+ O₂ Technology & Selection Guide
Gas Generator Technology, Purity Requirements & Supply Method Comparison for Semiconductor & Electronics
Selecting the correct on-site nitrogen generation system for microelectronics requires understanding three things: which generation technology produces the purity your application needs, what purity grade each process actually requires (higher purity costs more to produce — specifying above what the process needs wastes energy), and how on-site PSA generation compares to the alternatives across cost, reliability and purity verification. This guide covers all three decisions.
Primary Technology for Semiconductor
Pressure Swing Adsorption (PSA)
Achievable purity: 95% to 99.999% N₂
PSA nitrogen generators use two towers filled with Carbon Molecular Sieve (CMS) — a specially processed carbon material with pores sized to preferentially adsorb oxygen, CO₂ and other trace gases from compressed air while allowing nitrogen molecules to pass through to the product buffer tank. While one tower is adsorbing (producing nitrogen), the other is being regenerated by expanding the adsorbed gases to atmosphere. The towers alternate in cycles of typically 30–120 seconds, producing a continuous nitrogen flow.
PSA is the technology of choice for semiconductor and electronics applications because it achieves the highest purity levels — up to 99.999% (10 ppm O₂ or below) — required for lithography tool purging, wire bonding and wafer storage. Purity is controlled by cycle time and flow rate: slower cycles and lower extraction rates produce higher purity.
- Achieves 99.999% (5N) purity — matches delivered liquid nitrogen quality
- Dual-tower continuous operation — no production interruption between cycles
- Purity adjustable at commissioning to match actual process requirements
- Carbon molecular sieve bed lifespan typically 10+ years with clean dry air feed
- Feed air must be oil-free, dry and particle-free — requires upstream filtration
Best for Semiconductor wafer fab, high-purity applications ≥99.99%, any application requiring SEMI F78 documentation
Lower-Purity / Lower-Cost Option
Membrane Separation
Achievable purity: 95% to 99.5% N₂
Membrane nitrogen generators pass compressed air through hollow-fibre polymer membranes that are more permeable to oxygen and water vapour than to nitrogen. O₂ and H₂O diffuse through the membrane wall and are vented to atmosphere, while the nitrogen-enriched stream continues through the fibre bundle to the product outlet. The process is continuous with no moving parts and no cycle switching.
Membrane technology is simpler and lower-maintenance than PSA — with no molecular sieve beds to replace — but is limited to approximately 99.5% purity at reasonable flow rates. Higher purities are theoretically achievable but require very low extraction rates that make the system economically unattractive. Membrane generators are well-suited to lower-criticality electronics applications including wave soldering blanketing (95–99%), laser cutting nitrogen and general component protection where ultra-high purity is not required.
- No moving parts, no cycle timing — simpler maintenance than PSA
- Practical purity ceiling approximately 99.5% N₂
- Not suitable for semiconductor wafer fab or 99.99%+ applications
- Lower capital cost for lower-purity, lower-volume requirements
- Compact footprint — suitable for point-of-use installation
Best for Wave/reflow soldering blanketing at 95–99%, laser cutting, general component protection — not for wafer fab or SEMI F78 applications
N₂ Purity Requirements by Semiconductor & Electronics Application
Specifying nitrogen purity correctly is important — producing higher purity than the process requires wastes energy and compressor capacity, while insufficient purity causes process failures. This table maps the actual purity requirement of each application to the correct generator specification. Note that purity requirements at the generator outlet must account for any dilution from distribution piping — specify the generator to produce slightly higher purity than the point-of-use requirement if the distribution system is long.
| Application | Required N₂ Purity | Max O₂ | Generator Technology | Reason |
|---|---|---|---|---|
| Lithography Tool Purge (EUV / DUV) | 99.999% (5N) | <10 ppm | PSA — high purity grade | Oxygen absorbs EUV/DUV wavelength light; ppm-level O₂ shifts pattern placement at sub-10 nm nodes |
| Wire Bonding Atmosphere | 99.99% (4N) | <100 ppm | PSA — standard semiconductor grade | Bond pad and wire surface oxidation at >100 ppm O₂ reduces bond strength and long-term reliability |
| Wafer FOUP / SMIF Storage | 99.99% (4N) | <100 ppm | PSA — standard semiconductor grade | Native oxide growth on gate structures starts at ppm-level O₂; SEMI E47 specifies 99.99% minimum |
| CVD / ALD / Plasma Etch Purge | 99.999% (5N) | <10 ppm | PSA — high purity grade | Process gas purity chain requires inert purge gas at equivalent or better purity to prevent cross-contamination |
| Reflow Soldering (SMT) | 99.9–99.99% | 100–1,000 ppm | PSA — electronics grade | Solder oxidation reduction requires <1,000 ppm O₂; higher purity gives better wetting but 99.9% is practical minimum |
| Wave Soldering Atmosphere | 99.5–99.9% | 1,000–5,000 ppm | PSA or Membrane | Wave soldering is less sensitive than reflow; 99.5% N₂ prevents dross formation and improves joint quality |
| MSD Packaging & N₂ Cabinet | 99.9% | <1,000 ppm | PSA — electronics grade | J-STD-033 requires controlled humidity below 10% RH; N₂ backfill at 99.9% achieves this reliably |
| General Component Protection / Purge | 95–99% | 1–5% | PSA or Membrane | General oxidation prevention for component handling, equipment purging and non-critical storage |
Supply Method Comparison — On-Site PSA vs Liquid N₂ vs Cylinder Supply
All three gas supply methods can achieve the purity levels required for semiconductor and electronics manufacturing — the distinction is cost, reliability and practicality at the volumes a semiconductor facility or PCB assembly line requires.
Recommended for High-Volume On-Site PSA Generation
- Lowest operating cost — electricity only after payback
- No delivery dependency — 24/7 supply from local infrastructure
- Continuous purity monitoring at point of use
- Scalable modular capacity as demand grows
- No cryogenic or high-pressure cylinder hazards
- Capital investment required upfront (12–24 month payback)
- Requires clean, dry oil-free compressed air feed
- Periodic CMS bed monitoring and filter maintenance
High Volume but High Cost Delivered Liquid Nitrogen (LN₂)
- High purity available (99.999%+)
- High flow rates from bulk tank storage
- No capital investment in generation equipment
- Highest operating cost — 3–5× on-site PSA cost per m³
- Supply chain dependency — delivery scheduling required
- Cryogenic handling hazards — cold burns, asphyxiation risk
- Purity not verified at point of use — certified at source only
- Dewar/tank rental fees add to total cost of ownership
Low Volume Only High-Pressure Cylinder Supply
- No capital equipment — immediate availability
- Suitable for very low consumption or intermittent use
- Portable — usable where piped gas is unavailable
- Highest cost per m³ — uneconomic for any volume production
- Cylinder changeover creates purity and supply interruption risk
- High-pressure hazards — stored energy risk in production areas
- Cylinder rental, delivery frequency and handling overhead
- Not practical for semiconductor or PCB assembly volumes
Standards & Compliance
SEMI F78 SEMI S2 IPC J-STD J-STD-033 ISO 8573-1 JEDEC Standards SEMI E47
Switch to On-Site Nitrogen Generation
Our gas generation engineers will calculate your nitrogen consumption by application, model the cost savings versus your current supply method and design an on-site system matched to your semiconductor facility's gas demand profile.
Get expert guidance when you need it. Our support team is here to provide you with the right solutions.
