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Product Category · Electronics & SemiconductorFCG & Motion
FCG & Motion
Systems for
Electronics &
Semiconductor
Two integrated product categories are essential for semiconductor fabrication plants and electronics manufacturing facilities. The first includes fluid control solutions such as high-purity stainless steel tubing, process gas connection systems, cleanroom hose and fitting systems, and sealing technologies for process gas, chemical, and ultra-pure water (UPW) distribution. The second includes precision motion systems such as electromechanical actuators, cleanroom pneumatic systems, and hydraulic power units designed for process automation, wafer handling, and advanced manufacturing equipment.
✓ 316L SS / PTFE / PFA ✓ Process Gas Rated ✓ SEMI S2 Compatible ✓ Cleanroom Compatible
System Overview
Key Specifications
FCG Material316L electropolished SS, PTFE, PFA, Hastelloy
FittingsFace-seal (VCR-type), compression, orbital weld
SealingFFKM, PTFE, Viton O-rings for chemical service
MotionElectromechanical, pneumatic, hydraulic actuation
StandardsSEMI S2, SEMI F57, ISO 14644, ISO 4126
✓ UHP & High-Purity Grades ✓ SEMI S2 / F57 Compatible ✓ Cleanroom Compatible ✓ Orbital Weld Capable ✓ Corrosive Chemical Rated
Industry Overview
Why Fluid Control & Motion Systems Are the Infrastructure of Every Semiconductor Fab
Every semiconductor process tool is connected to the facility by two types of infrastructure: fluid conveyance systems delivering process gas, chemicals and ultra-pure water to the tool at the correct purity, pressure and flow rate — and motion systems driving every actuator, positioning stage and robotic handler inside and around those tools. Both categories span the entire facility, from the gas cabinets and chemical delivery systems in the sub-fab below the cleanroom floor, through the tool hook-up network, to the precision positioning stages at the heart of the most sensitive process equipment.
A high purity stainless steel tubing and fitting system in a semiconductor fab must maintain sub-ppb-level contamination control — any particle, moisture or ionic contamination introduced by a fitting, tube or valve will travel directly to the process tool and potentially to the wafer surface. Fluid connectors for semiconductor manufacturing are therefore specified in 316L electropolished stainless steel, PTFE or PFA — all with surface finishes and cleanliness standards far beyond general industrial requirements.
Motion systems in semiconductor environments must similarly meet cleanroom compatibility requirements — precision motion control components installed in or near cleanroom areas must not generate particles from drive mechanisms, lubricants or component wear that would compromise cleanroom classification. Sealed electromechanical actuators, oil-free pneumatic cylinders and cleanroom-grade linear guides address this requirement.
- 316L electropolished SS and PTFE/PFA for ultra-high purity fluid lines
- Face-seal and orbital-weld fittings for all-metal leak-tight process gas connections
- FFKM and PTFE sealing for aggressive chemical and high-temperature service
- Cleanroom-grade pneumatic and electromechanical motion components
- Hydraulic power units for high-force tool actuation (CMP, bonding, press)
- Full system design, assembly and commissioning documentation
Why It MattersWhy Fluid & Motion System Integrity Is Critical to
Why Fluid & Motion System Integrity Is Critical to
Semiconductor & Electronics Manufacturing
01🧪Process Gas & Fluid Purity
Fluid System Integrity Determines Process Gas & Chemical Purity
In semiconductor manufacturing, process gas connection systems and chemical delivery lines are the last boundary between the ultra-high purity gases and chemicals in storage and the wafer surface where they react. A single fitting leak, a particle shedding surface inside a tube, or an incorrect seal material that outgasses into a specialty gas stream contaminates the process — causing parametric yield failures or tool alarms that halt production. High purity chemical tubing solutions in 316L electropolished stainless steel and PFA polymer prevent contamination at every connection point.
Process Impact
Specialty gases such as silane, arsine, phosphine and HCl are supplied at 99.9999% (6N) purity — a single contaminated fitting or incorrect tube material undoes the entire gas purification chain upstream.
02🎯Precision Motion & Positioning
Precision Motion Systems Determine Wafer Handling & Stage Accuracy
Wafer fabrication motion control systems — from the pneumatic end-effectors that transfer wafers between cassettes and process tools, to the electromechanical positioning stages inside lithography scanners and inspection equipment — must provide micron-level repeatability without particle generation. Electromechanical motion control systems with sealed linear guides, recirculating ball screws and integrated servo drives deliver the positioning accuracy that advanced process tools require, while cleanroom-compatible design prevents drive mechanism particles from reaching wafer surfaces.
Yield Impact
A wafer handling robot that generates particles from bearing wear, or a positioning stage with sub-micron backlash, directly causes contamination events and process inaccuracies that manifest as yield loss across every wafer batch handled.
03🛡️Leak Protection & Safety
Leak Protection Systems Are Critical for Process Safety & Uptime
Leak protection systems for process fluids in semiconductor fabs must address two distinct risks: the yield impact of a process fluid leak contaminating the cleanroom or a process tool, and the safety risk of a toxic or corrosive specialty gas or chemical leak reaching personnel. Face-seal fittings with metal gasket seals, all-welded stainless steel runs for corrosive gas service, double-containment PTFE lines for aggressive chemical delivery, and industrial sealing and protection solutions with scheduled replacement intervals — all working together to eliminate leak events before they occur.
Safety Impact
SEMI S2 requires that all process tool fluid systems be designed, installed and maintained to prevent hazardous leaks — the fluid connectors and sealing components are the primary implementation of this requirement at every connection point in the system.
Product Range
FCG Fluid Systems & Motion Control for Semiconductor & Electronics
Two complementary product ranges address the fluid conveyance and motion actuation requirements of semiconductor and electronics manufacturing — each specified to the purity, pressure and cleanroom compatibility demands of process tool environments.
⭐ Fluid Control Group (FCG) 🔩
High-Purity Fluid Control Components & Systems
Complete range of fluid connectors for semiconductor manufacturing — 316L electropolished stainless steel tubing, face-seal and compression tube fittings, high-purity valves, pressure regulators, flexible PTFE/PFA hose assemblies, O-ring and FFKM sealing solutions and cleanroom-certified hose assemblies for process gas, chemical and UPW distribution.
Technical Specifications
| Tubing | 316L electropolished SS; PFA/PTFE for chemical service |
| Fittings | Face-seal (VCR/VCO), compression, orbital-weld butt weld |
| Valves | Diaphragm, bellows-sealed, solenoid — UHP and corrosive grade |
| Sealing | FFKM, PTFE, Viton, metal gasket — chemical and temperature rated |
| Pressure | High-pressure hydraulic assemblies to 700 bar; gas lines to 200 bar |
Applications
Motion Systems ⚙️
Precision Motion Control & Automation Systems
Full range of precision motion control components for semiconductor equipment and process tool automation — servo-driven electromechanical actuators, cleanroom-grade pneumatic cylinders and grippers, hydraulic power units for high-force actuation, linear motion guides and ball screws, and integrated motion control electronics for wafer handling and precision positioning applications.
Technical Specifications
| Electromechanical | Servo motors, ball screw actuators, linear stages — sub-µm repeatability |
| Pneumatic | Cleanroom ISO Class 3–6 compatible cylinders, grippers and slides |
| Hydraulic | High-force HPU systems for CMP, bonding and press applications |
| Linear Guides | Recirculating ball, crossed roller — low particle emission options |
| Control | Servo drives, stepper controllers, PLC-compatible I/O |
Applications
Why Choose Us
Benefits of Our Semiconductor FCG & Motion System Solutions
Every fluid connector, tube fitting and motion component in a semiconductor fab is specified to a level that general industrial catalogues do not reach — material purity, surface finish, cleanliness certification and leak integrity are non-negotiable requirements that our range is built to meet.
01🔬
Ultra-High Purity Material Selection
High purity stainless steel tubing in 316L electropolished grade, PFA and PTFE polymer components, and FFKM seals are specified from the outset — not uprated from general industrial parts — ensuring the entire fluid path meets semiconductor-grade contamination control requirements.
02🔒
Leak-Tight Connection Technology
Face-seal fittings with metal gasket seals and orbital-weld butt joints provide the highest available integrity for process gas connection systems — eliminating the elastomer seal contact with process gas that can cause outgassing and sub-ppb level contamination of specialty gas streams.
03🏭
Cleanroom-Compatible Motion Components
Sealed linear guides, low-outgassing lubricants, stainless-steel and anodised aluminium construction — pneumatic motion systems for cleanroom and electromechanical drives that do not generate particles or volatile organic compounds that would compromise cleanroom classification or wafer surface purity.
04⚡
Integrated System Design
FCG fluid components and motion systems are specified and integrated together as complete utility subsystems — from integrated hydraulic power units for CMP actuation to complete gas panel assemblies with valve manifolds, pressure regulators and instrumentation — reducing commissioning time and eliminating interface mismatch between components.
05📋
SEMI S2 & F57 Compliance Documentation
All fluid system components supplied with material certifications, cleanliness test records and pressure test documentation — and all motion systems with performance test data — supporting SEMI S2 Environmental Health & Safety compliance and SEMI F57 ultra-high purity component documentation requirements.
06🤝
Local Engineering & System Support
Our Thailand-based engineers provide local support for system design, component selection, assembly, installation and commissioning — with the technical capability to support both contamination control fluid systems for process gas and chemical lines and precision motion system integration for semiconductor process tools.
Applications
FCG & Motion System Applications in Semiconductor & Electronics Manufacturing
Fluid control and motion system requirements vary by process stage and application criticality — from ultra-high purity specialty gas lines in the wafer fab to general pneumatic automation in back-end packaging and electronics assembly.
⚗️
Process Gas Distribution
Wafer Fab Utility
High purity gas distribution systems — 316L electropolished tubing, face-seal fittings, diaphragm valves and pressure regulators for specialty gas (N₂, Ar, H₂, SiH₄, NH₃) from gas cabinet to point-of-use at process tools
SEMI F57, SEMI S2🧪
Corrosive Gas & Chemical Lines
Wet Process / Etch
High purity chemical tubing solutions in Hastelloy, PTFE and PFA for corrosive gas (HF, Cl₂, HCl) and wet chemical (H₂SO₄, H₂O₂, HF) delivery — double-containment where required for hazardous chemical service
SEMI S2, SEMI F57💧
UPW & DI Water Distribution
Water Distribution
High-purity stainless steel and PTFE tubing with compression or orbital-weld fittings for ultra-pure water distribution — maintaining resistivity throughout the point-of-use distribution network to wafer cleaning tools and wet benches
SEMI F63, facility spec🤖
Wafer Handling & Transfer
Wafer Logistics
Wafer fabrication motion control systems — cleanroom-grade pneumatic grippers and electromechanical actuators for FOUP handling, wafer cassette transfer and robotic end-effectors between process tools in AMHS-connected fab environments
SEMI E84, SEMI E47🔧
CMP & Press Tool Actuation
High-Force Actuation
Integrated hydraulic power units and precision pressure control for CMP polishing head load and retaining ring pressure, bonding tool actuation and wafer press applications — requiring hydraulic force control to sub-Newton precision
SEMI S2, process spec📦
Back-End & Electronics Assembly
Packaging & Assembly
Industrial pneumatic automation systems for PCB pick-and-place, component handling, wire bonding and IC packaging — lower-purity fluid connectors and standard pneumatic motion components for non-cleanroom-critical assembly environments
JEDEC, IPC standards Component Selection Guide
FCG & Motion System Components — Selecting the Right Specification for Each Semiconductor Process
Selecting the correct fluid control components for wafer fabrication and motion system specification depends on the specific process fluid, pressure and contamination requirement of each application — and selecting the correct motion technology depends on the force, speed, accuracy and cleanroom compatibility requirement of each actuation task. Getting either selection wrong introduces either contamination risk or process inaccuracy that is far more costly to remediate than specifying correctly from the outset. This guide maps the key component decisions for both FCG and motion systems in semiconductor and electronics manufacturing.
Fluid Control Group — FCG
Key Fluid System Components & Specifications
Ultra-High Purity Gas Lines
Face-Seal Fittings (VCR / VCO Type)
All-metal seal fittings using a soft metal gasket (nickel or stainless steel) compressed between two machined faces — creating a seal with zero elastomer contact with the process gas. The standard for specialty gas connections where outgassing or particle generation from an elastomer O-ring would contaminate the gas stream at sub-ppb levels. Used on all SEMI F57 ultra-high purity gas lines.
SEMI F57
UHP Gas
UHP Gas
Electropolished SS Tubing
316L EP Stainless Steel Tube
316L grade stainless steel with electropolished internal surface (Ra ≤ 0.25 µm typical for UHP applications). Electropolishing removes the chromium-depleted layer, creating a chromium-rich oxide surface that is highly corrosion-resistant and has very low particle adhesion. Used for all process gas distribution runs, UPW mains and chemical lines where metallic tubing is specified. Passivated after assembly for SEMI F57 compliance.
316L EP
Ra ≤ 0.25µm
Ra ≤ 0.25µm
Chemical Delivery — Corrosive Service
PTFE / PFA Tubing & Fittings
Polytetrafluoroethylene (PTFE) and perfluoroalkoxy alkane (PFA) tubing and fittings for aggressive chemical service where stainless steel is not compatible — HF, H₂SO₄/H₂O₂ (Piranha), SC-1 and SC-2 cleaning solutions, and other oxidising or reducing chemistries. PFA is preferred over PTFE for cleaner ultrasonic extraction performance and is more suitable for high purity chemical tubing solutions in UHP chemical delivery systems.
PFA / PTFE
Chemical
Chemical
Process Sealing — All Service
FFKM / Viton / PTFE O-Rings
Seal material selection is critical — the wrong elastomer in contact with process gas or chemical causes outgassing, swelling, particle generation or chemical attack. Industrial O-ring sealing solutions: FFKM (perfluoroelastomer) for the broadest chemical resistance at high temperatures; Viton for moderate chemical environments; PTFE encapsulated for static seals in highly corrosive service. All seals in process-wetted positions must be material-certified and lot-traceable.
FFKM / Viton
/ PTFE
/ PTFE
Motion Systems
Key Motion Components & Specifications
High-Accuracy Positioning
Electromechanical Linear Actuators
Servo motor combined with precision ball screw or linear motor drive, mounted on crossed-roller or recirculating ball linear guides. Provides sub-micron repeatability with no stick-slip and full programmable control of position, velocity and force. Used for precision wafer stage positioning, inspection focus drives and any application requiring closed-loop position control. Sealed designs with low-outgassing lubricants for cleanroom compatibility.
Sub-µm
Repeatability
Repeatability
Wafer Handling / Valve Actuation
Cleanroom Pneumatic Cylinders & Grippers
ISO-certified cleanroom-grade pneumatic cylinders and grippers for wafer cassette handling, FOUP door mechanisms, valve actuators and general pick-and-place automation. Stainless-steel body, low-friction seals, clean-room compatible lubricants and sealed construction prevent particle generation inside the cleanroom environment. Oil-free compressed air supply required. Pneumatic motion systems for cleanroom applications rated for ISO Class 3–6.
ISO Class
3–6 Rated
3–6 Rated
High-Force Process Actuation
Hydraulic Power Units & Actuators
Integrated hydraulic power units for applications requiring forces beyond the practical range of pneumatic or electromechanical actuation — CMP polishing head loading (typically 50–300 N), wire bonding press force and wafer bonding tool actuation. Hydraulic systems provide smooth, controllable high force with compact actuator size. Cleanroom installations use sealed hydraulic circuits with low-volatility fluid to prevent contamination from hydraulic oil vapour.
High-Force
Precision
Precision
Power Transmission
Mechanical Drive Components
Precision mechanical drive components — planetary gearboxes, timing belt drives, rack-and-pinion systems and flexible couplings for motion transmission in semiconductor equipment. Drive component selection affects positioning accuracy, backlash, inertia matching and particle generation. Sealed gearboxes with cleanroom-compatible lubricants; timing belts in antistatic materials for cleanroom compatibility; zero-backlash couplings for servo applications requiring high dynamic positioning accuracy.
Zero-Backlash
Cleanroom
Cleanroom
Fluid System Material Selection by Application
The correct tubing, fitting and seal material must be matched to the specific process fluid — chemical compatibility, temperature rating, outgassing performance and cleanliness level all determine which material is appropriate. Using the wrong material in a process-wetted position introduces contamination that may be invisible in routine inspection but detectable at the wafer level.
| Process Fluid | Tubing Material | Fitting Type | Seal Material | Key Requirement |
|---|---|---|---|---|
| Specialty Gas (N₂, Ar, H₂, SiH₄) | 316L Electropolished SS, Ra ≤ 0.25 µm | Face-seal (VCR metal gasket) | Nickel or SS metal gasket — no elastomer | Sub-ppb contamination control; SEMI F57 UHP certification required |
| Corrosive Gas (HF, Cl₂, HCl, BCl₃) | Hastelloy C-276 or PFA | Face-seal or all-weld butt joint | FFKM — highest chemical resistance | Corrosion resistance to halogen compounds; double-containment where required by SEMI S2 |
| Wet Chemical (H₂SO₄, H₂O₂, HF acid) | PFA or PTFE (non-metallic throughout) | PFA compression or flare fittings | PTFE or FFKM | No metal contact with oxidising chemistry; all polymer wetted path |
| Ultra-Pure Water (UPW / DI) | 316L EP SS or PVDF for high-flow mains | Compression or orbital-weld | EPDM or FFKM for UPW service | Maintain resistivity ≥ 18 MΩ·cm; no TOC extractables from wetted materials |
| Process Cooling Water (PCW) | 316L SS (standard or EP depending on zone) | Compression or threaded NPT for sub-fab | EPDM or Viton | Resistivity maintenance; no ionic contamination leaching from fittings into PCW circuit |
| Hydraulic Fluid (HPU circuits) | Carbon steel or 304/316 SS hydraulic tube | High-pressure hydraulic fittings — 24° cone or SAE face-seal | NBR or Viton for mineral oil; FFKM for synthetic fluid | High-pressure rated to working pressure × 4 safety factor; cleanroom HPU circuits use low-volatility synthetic fluid |
Design Principle — FCG Minimising Connections & Joints in Process Fluid Lines
Every fitting, joint or valve in a process gas connection system or chemical delivery line is a potential source of contamination — whether from particle generation at the fitting interface, outgassing from seal materials, or a leak path for process fluid or ambient air ingress. The fundamental design principle for high-purity fluid systems is to minimise the total number of connections through tube bending (rather than elbows), long tube runs (rather than joined sections), and all-welded construction where permanent connections are acceptable.
Where connections must be separable for maintenance — at valve bodies, instrument taps and tool interfaces — face-seal fittings are preferred over compression fittings because the metal gasket seal eliminates the particle generation that can occur at the compression fitting ferrule-tube interface during repeated make-and-break cycles. All joints in UHP process gas lines must be pressure-tested and helium leak-tested after assembly before the system is passivated and placed in service.
Design Principle — Motion Matching Motion Technology to Force, Speed & Accuracy
The three primary motion technologies — pneumatic, electromechanical and hydraulic — each cover a different region of the force-speed-accuracy design space, and selecting the wrong technology for an application creates either under-performance or unnecessary cost and complexity. Pneumatic motion systems for cleanroom are appropriate for fast, high-cycle, moderate-force applications where position accuracy is defined by end-stops (wafer gripping, valve actuation, part transfer) — they are not appropriate where continuous position control is required.
Electromechanical motion control systems using servo drives and ball screws provide closed-loop position control with sub-micron repeatability — appropriate for precision positioning stages, inspection equipment drives and any application where intermediate position control and programmable profiles are required. Integrated hydraulic power units remain the technology of choice for high-force, moderate-speed applications where the force-to-actuator-size ratio of hydraulics is required — CMP polishing head loads, bonding press actuation and heavy wafer carrier handling mechanisms.
Standards & Compliance
SEMI S2 SEMI F57 SEMI F63 ISO 14644 ISO 4126 ISO 8573-1 SEMI E84
Specify Your Semiconductor FCG & Motion System
Our engineers will select the correct fluid system materials, fitting types and motion technology for each application in your semiconductor or electronics facility — from ultra-high purity process gas distribution to precision wafer handling motion systems.
Get expert guidance when you need it. Our support team is here to provide you with the right solutions.
