฿9,300.00
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Product Category · Electronics & SemiconductorProcess Filtration
Process Filtration
for Electronics
& Semiconductor
A complete semiconductor manufacturing filtration system covers multiple critical process streams throughout the production environment. These include ultrapure water (UPW) point-of-use filters down to 0.01 µm, membrane filtration systems for chemical delivery processes, CMP slurry filters designed to remove oversized particles while maintaining abrasive performance, and point-of-dispense filters for photoresist applications. Each filtration stage plays a critical role in contamination control, process stability, and semiconductor production yield.
✓ 0.01 µm UPW Filtration ✓ CMP Slurry Rated ✓ PTFE / PFA / PES / PVDF ✓ SEMI F57 Compatible
System Overview
Key Specifications
UPW Filtration0.01–0.05 µm — point-of-use membrane filters
Chemical Filters0.05–0.2 µm — PTFE/PFA for wet process chemistry
CMP Slurry0.5–5 µm — selective abrasive pass-through
Photoresist0.02–0.1 µm — nylon or PTFE point-of-dispense
ComplianceSEMI F57, SEMI S2, ISO 14644
✓ 0.01 µm UPW Grade ✓ CMP Slurry Rated ✓ PTFE / PFA / PES / PVDF ✓ SEMI F57 Compatible ✓ High-Purity Housings
Industry Overview
Why Process Filtration Is the Last Line of Defence Against Yield Loss in Semiconductor Manufacturing
Semiconductor manufacturing is a multi-step process in which particles, ionic contamination and chemical impurities must be controlled to sub-nanometre levels at every stage. Process filtration for the electronics industry operates at the boundary between the fluid supply system and the wafer surface — it is the final barrier that prevents contamination from the facility's chemical and water distribution infrastructure from reaching and damaging the device being fabricated.
A high purity process filtration system in a semiconductor fab typically encompasses five distinct fluid streams, each requiring a different filter media, rating and housing material: ultrapure water (UPW) at the point of use to wafer cleaning tools, wet process chemicals at the point of entry to each wet bench, CMP slurry at the polishing tool, photoresist and developer at the point of dispense, and process effluent at the end-of-drain before treatment. Each of these streams has unique contamination challenges and specific filtration requirements — and selecting the wrong filter for any of them introduces contamination or causes yield loss through an incorrect mechanism.
Thailand's growing semiconductor and electronics manufacturing base — spanning HDD components, power semiconductors, PCBA, advanced packaging and display manufacturing — demands wafer fabrication filtration technology specified to the same standards as the world's most advanced fabs, now available from local engineering support throughout the country.
- UPW point-of-use filters to 0.01 µm — sub-micron particle removal
- Chemical-compatible PTFE and PFA membranes for wet process chemistry
- CMP slurry filters — remove oversize particles, pass working abrasives
- Photoresist and developer point-of-dispense filtration
- High-purity SS and polymer housings — low extractables, no contamination
- Complete system documentation for SEMI F57 qualification
Why It MattersWhy Process Filtration Quality Determines
Why Process Filtration Quality Determines
Semiconductor Yield and Electronics Product Reliability
01💧UPW Purity at Point of Use
UPW Filtration Quality at the Point of Use Determines Wafer Surface Purity
Ultrapure water is consumed in enormous quantities throughout semiconductor manufacturing — the RCA Clean sequence, dilute HF rinses, post-etch cleaning and wafer drying all use UPW as the primary medium. Ultrapure water filtration for semiconductor at the point of use to wafer cleaning tools removes particles, bacterial contamination and any particle breakthrough from the distribution system before the water contacts the wafer. A single unfiltered particle large enough to span a critical dimension on the device can cause a hard defect — at 0.01 µm filter ratings, the water purity at point of use matches the quality required by the most advanced fab processes.
Yield Impact
UPW particle counts are a key SPC parameter in semiconductor fabs — a filter bypass or saturated filter that allows particle breakthrough causes measurable yield impact across every wafer processed at the affected tool until the filter is restored.
02⚗️Chemical Purity at Delivery
Chemical Filtration Removes Particles That the Upstream Supply Chain Cannot Guarantee
Electronic grade chemicals — HF, H₂SO₄, H₂O₂, NH₄OH, HCl, SC-1 and SC-2 cleaning solutions, photoresist, BARC and developer — are purchased to defined purity specifications, but can still contain particles introduced during transportation, storage and distribution within the fab. Chemical filtration in semiconductor process at the point of delivery to each wet bench, etch tool and coating track removes these introduced particles before the chemical contacts the wafer. For photoresist in particular, gel particles and micro-agglomerates that pass through bulk filtration can cause coating defects that write off the affected wafer at pattern inspection.
Process Impact
Chemical delivery filters are high-change-frequency consumables — a filter that has reached its dirt-holding capacity introduces particles rather than removing them, making scheduled filter change-out a direct yield control parameter.
03🔬CMP Slurry Integrity
CMP Slurry Filtration Must Remove Oversize Particles Without Removing the Working Abrasive
CMP slurry filtration presents a unique technical challenge not found in any other semiconductor filtration application: the filter must remove large, hard abrasive agglomerates and contamination particles that would scratch and gouge the wafer surface, while simultaneously allowing the smaller working abrasive particles to pass through to perform the polishing action. Submicron filtration for microchip production in CMP applications uses depth filtration or tangential-flow designs with ratings in the 0.5–5 µm range, matched to the specific slurry particle size distribution — different slurries for oxide, metal and barrier CMP each have different filter specifications.
Fab Impact
A scratch induced by an unfiltered oversize particle in CMP propagates across an entire wafer in a linear track — a single scratch event at a critical CMP step can write off 10–30% of the wafer's die, with the damage pattern clearly visible at post-CMP inspection.
Product Range
Process Filtration Systems for Semiconductor & Electronics Manufacturing
Our microelectronics liquid filtration solution range covers all five fluid filtration streams in semiconductor manufacturing — UPW point-of-use, chemical delivery, CMP slurry, photoresist/developer, and process effluent — with filter media, ratings and housings specified for each fluid chemistry and application.
⭐ UPW & Chemical Filtration 💧
UPW Point-of-Use & Chemical Delivery Filters
High-purity membrane filters for ultrapure water filtration for semiconductor at 0.01–0.05 µm, and chemical delivery filters in PTFE, PFA, nylon and PES membrane for wet process acids, bases, solvents and photoresist — housed in high-purity stainless steel or all-polymer housings with low extractables.
Technical Specifications
| UPW Rating | 0.01–0.05 µm — absolute membrane |
| Chemical Rating | 0.05–0.2 µm — matched to fluid viscosity |
| Photoresist | 0.02–0.1 µm — nylon or PTFE point-of-dispense |
| Membrane | PTFE, PFA, PES, Nylon — chemistry-matched |
| Housing | 316L SS EP or all-polymer — low extractables |
Applications
CMP & Slurry Filtration 🔬
CMP Slurry & Process Effluent Filtration
Depth filtration and tangential-flow filter systems for chemical filtration in semiconductor process — CMP slurry filters rated 0.5–5 µm to remove oversize abrasive particles while allowing working particles to pass, and end-of-line process effluent filters for wastewater treatment before chemical neutralisation and discharge.
Technical Specifications
| CMP Rating | 0.5–5 µm — matched to slurry particle size distribution |
| Filter Type | Depth filter or tangential-flow — slurry type specific |
| Membrane | PVDF or polypropylene — slurry-compatible |
| Effluent | Coarse pre-filtration 5–50 µm before treatment |
| Compliance | SEMI F57, SEMI S2; effluent to local discharge spec |
Applications
Why Choose Us
Benefits of Our Semiconductor Process Filtration Systems
An industrial filtration solution for semiconductor manufacturing must be specified to the fluid chemistry, particle size requirement and contamination sensitivity of each specific application — a single generic filter specification across multiple fluid streams creates either under-performance or unnecessary cost in every position where it is applied.
01🎯
Application-Specific Filter Selection
Each filter position in the process chain is specified individually — membrane material matched to the fluid chemistry, micron rating matched to the particle size requirement, and housing material matched to the pressure and extractables requirement. This is what separates a high purity process filtration system from a general industrial filtration catalogue selection.
02🔬
Sub-Micron to 0.01 µm Ratings
Submicron filtration for microchip production at 0.01 µm absolute membrane rating for UPW and photoresist applications — capturing particles that would otherwise cause gate oxide defects, photolithography coating defects and parametric failures at feature sizes below 10 nm.
03⚗️
Chemical Compatibility Across All Wet Process Chemistries
PTFE, PFA, PES, nylon and PVDF membrane options with stainless steel or all-polymer housings cover the full range of semiconductor wet process chemistries — from strongly oxidising Piranha solution to HF, and from photoresist to CMP slurry — without filter material degradation or contamination of the fluid being filtered.
04📊
Pressure Drop Monitoring & Change-Out Scheduling
Filter differential pressure monitoring provides early warning of filter saturation — allowing planned filter change-out before a saturated filter begins passing particles rather than removing them. Scheduled change-out based on pressure drop data keeps each wafer fabrication filtration technology position within its performance specification throughout its service life.
05📋
SEMI F57 Compatible Documentation
Filter material certifications, extractables test data, pressure test records and commissioning documentation for every installation — supporting SEMI F57 ultra-high purity component documentation requirements and providing the quality evidence needed for process fluid qualification audits.
06🤝
Integrated System Design Including Effluent
We design the complete process filtration system from UPW point-of-use through to process effluent pre-filtration before chemical neutralisation — providing a coherent contamination control strategy across all fluid streams rather than sourcing individual filter positions in isolation.
Applications
Process Filtration Applications in Semiconductor & Electronics Manufacturing
Each process stage in semiconductor and electronics manufacturing generates a distinct fluid contamination challenge — requiring a specific filter media type, micron rating and housing material selected for that fluid chemistry and contamination profile.
💧
UPW Point-of-Use — Wafer Clean
Wet Clean / Rinse
0.01–0.05 µm absolute membrane filter immediately upstream of wafer cleaning tools — removes particles, bacteria and any distribution system breakthrough before water contacts wafer. UPW particle counts typically specified at <1 particle/mL ≥0.05 µm
SEMI F63, SEMI F57⚗️
Wet Process Chemical Delivery
Wet Etch / Clean Chemistry
0.05–0.2 µm PTFE or PFA membrane filters for HF, H₂SO₄, H₂O₂, NH₄OH, HCl and mixed chemistry SC-1/SC-2 solutions at point of delivery to each wet bench — removes particles introduced during distribution without chemical reaction with the filter membrane
SEMI S2, SEMI F57🎨
Photoresist & Developer Filtration
Photolithography
0.02–0.1 µm nylon or PTFE point-of-dispense filters for photoresist, anti-reflective coating (ARC/BARC) and developer — removes gel particles and micro-agglomerates that cause coating defects and develop non-uniformity at the wafer surface
SEMI F57, process spec🔬
CMP Slurry Filtration
Chemical Mechanical Planarisation
0.5–5 µm depth or tangential-flow PVDF filters matched to each slurry type (oxide, metal, barrier) — removes oversize abrasive agglomerates that cause wafer scratching, while allowing the working abrasive particle population to pass to the polishing interface
CMP process specification🧪
IPA Wafer Drying & Solvent Circuits
Post-Clean Drying
0.02–0.05 µm PTFE or PVDF membrane filters for isopropyl alcohol (IPA) Marangoni drying circuits and solvent-based chemical delivery — IPA must be ultra-clean at point of delivery as it is the final fluid contacting the wafer before drying
SEMI F57, process spec🔧
Electronics Assembly & PCB Production
PCB / PCBA Assembly
Chemical filtration for PCB cleaning chemistries, flux removal solvents and rinse water in wave and reflow soldering lines — lower criticality than wafer fab but still requiring chemical-compatible filter media and change-out scheduling to maintain cleaning bath performance
IPC standards, facility spec Filtration Technology Guide
Process Filtration Technology, Media Selection & Semiconductor Wastewater Treatment
Selecting the correct filter media for each position in the semiconductor process fluid chain is as important as selecting the correct micron rating. Using the wrong membrane material in contact with an incompatible process chemistry causes filter degradation, extractable contamination of the fluid and premature filter failure — all of which introduce contamination to the wafer. This guide covers the four critical filtration streams in semiconductor manufacturing and the correct technology for each, plus semiconductor process effluent treatment — a topic increasingly relevant as water usage and chemical discharge regulations tighten for electronics facilities in Thailand.
Stream 1 — Ultrapure Water
UPW Point-of-Use Filtration
UPW used in semiconductor wafer cleaning and rinsing is the most intensively filtered fluid in the fab. Bulk UPW from the facility polishing loop typically meets resistivity, TOC and particle count specifications — but the distribution network from the polishing loop to each tool introduces risk: biofilm growth in low-flow branch lines, particle generation from pipe connections and degradation of O-ring seals in distribution fittings. Point-of-use membrane filters at 0.01–0.05 µm absolute rating address this distribution system contribution, capturing any particles that originate in the pipework between the central polishing system and the tool inlet.
Filter membrane material for UPW service is typically PTFE or PES (polyethersulfone). PES offers good flow characteristics and low extractables at neutral pH; PTFE is preferred where the UPW circuit occasionally carries dilute acid rinses or where the highest possible chemical inertness is required. Housing material is typically 316L electropolished stainless steel — avoiding polymer housing materials that could contribute TOC extractables to the UPW stream.
- UPW quality target: resistivity ≥18 MΩ·cm; TOC <1 ppb; particles <1/mL ≥0.05 µm
- Filter monitors: upstream and downstream particle counter on critical tool loops
- Change-out trigger: pressure differential, particle count exceedance or time-based schedule
- Housing: 316L EP SS — no polymer that could contribute TOC to UPW circuit
Key membrane materials PTFE (highest chemical inertness), PES (low extractables, high flow) — both suitable for UPW service to 0.01 µm
Stream 2 — Wet Process Chemicals
Chemical Delivery Filtration
Wet process chemicals in semiconductor manufacturing span a wide range of chemistries that require different membrane materials to ensure chemical compatibility and prevent filter degradation. The fundamental selection rule is that no component of the filter membrane or housing should react with, swell in, or leach extractables into the process chemical — contaminating the chemical before it reaches the wafer.
PTFE membrane is the broadest-compatibility choice — chemically inert to virtually all semiconductor wet process acids, bases and oxidisers including concentrated H₂SO₄, HF, H₂O₂ and their mixtures. PFA membrane is preferred for photoresist, BARC and developer circuits where ultra-low extractables are critical for sub-10 nm lithography. Nylon 66 membrane is used for organic solvent and resist applications where its particle retention efficiency at low pressure drop is advantageous. PES membrane is suitable for near-neutral aqueous chemistries but is not compatible with strong acids or strong oxidisers — specifying PES in an HF or Piranha service position is a common specification error that causes premature filter failure and fluid contamination.
- HF, H₂SO₄, H₂O₂, Piranha: PTFE membrane only — no PES, nylon or polypropylene
- NH₄OH, SC-1, SC-2: PTFE or PFA — high pH compatible membranes
- Photoresist, BARC, EBR: nylon 66 or PFA — low extractables critical for EUV applications
- Developer (TMAH): PTFE or PES — nylon incompatible with alkaline developer
- IPA, organic solvents: PTFE or PVDF — compatible with alcohol and ketone solvents
Critical selection rule Never specify PES or nylon membrane in contact with HF, strong acids or strong oxidisers — PTFE is the safe default for unknown or aggressive chemistries
Stream 3 — CMP Slurry
CMP Slurry Filtration
CMP slurry filtration is the most technically challenging filtration application in semiconductor manufacturing. The objective is to selectively remove oversize particles — hard agglomerates of abrasive, contamination particles and gel clusters that form over time in slurry storage and distribution — while leaving the intended working abrasive population intact and at its specified concentration. A standard membrane filter that removes all particles above a defined size cannot achieve this: it would block the working abrasive as readily as the oversize particles, increasing the cut-point required and reducing the filter's selectivity.
The correct approach uses depth filtration for slurries where the oversize particles are significantly larger than the working abrasive (oxide and dielectric CMP slurries), or tangential-flow filtration for slurries where the size separation between oversize and working particles is small (metal CMP, barrier slurries). Depth filters use a graded-density internal structure that captures particles above the oversize threshold while allowing smaller particles to pass in cross-flow. Tangential-flow systems recirculate the slurry across a membrane surface, concentrating oversize particles in the reject stream while passing the filtered slurry to the tool.
- Oxide CMP slurry: 1–3 µm depth filter — working abrasive typically 100–200 nm
- Metal CMP (Cu, W, Co): 0.5–1 µm depth — tighter specification than oxide CMP
- Barrier / STI slurry: tangential-flow — narrow size distribution requires crossflow selectivity
- Filter material: PVDF or polypropylene — compatible with slurry oxidisers (H₂O₂)
- Change-out: pressure differential across filter — not time-based; slurry loading varies significantly
Critical design principle CMP filter rating must be verified against the actual slurry particle size distribution — a filter that is too tight removes working abrasive; too coarse fails to capture damaging oversize particles
Stream 4 — Process Effluent
Semiconductor Wastewater Pre-filtration
Semiconductor fabrication generates process effluent that must be treated before discharge to the municipal drain — and in many facilities, the treated effluent is recovered and recycled back into the facility water system to reduce freshwater consumption. The effluent streams from a semiconductor fab include acid/alkali waste from wet bench rinse overflows, CMP slurry drain containing abrasive particles and chemical residues, developer waste (TMAH-containing alkaline effluent), and general rinse water from cleaning processes. Each of these streams has different chemical composition and particle loading, and each requires a different treatment approach.
Pre-filtration of process effluent removes coarse particles — primarily CMP slurry abrasive, silicon debris from wafer processing and chemical precipitates — before the effluent enters the chemical neutralisation and treatment system. Removing solids before treatment prevents clogging of pH neutralisation reactors and reduces chemical consumption in the treatment process. Coarse pre-filters at 5–50 µm in chemical-resistant polypropylene or PVDF housings handle the mixed chemistry and varying pH of fab effluent without membrane degradation.
- Acid/alkali waste pre-filter: 10–25 µm polypropylene — removes precipitates before neutralisation
- CMP drain pre-filter: 5–10 µm PVDF — removes slurry abrasive and Si debris
- DI water recovery loop: 0.1–0.2 µm membrane — polishes recycled rinse water before reuse
- Metal removal: ion exchange or membrane filtration following chemical precipitation
- Treatment discharge monitoring: turbidity and pH continuously monitored at outlet
Regulatory context Thailand's industrial effluent standards (Ministry of Industry) require treated semiconductor process effluent to meet pH, heavy metal and suspended solid limits before discharge — pre-filtration is the first step in achieving compliance
Filter Membrane Material Selection by Semiconductor Process Fluid
This table maps the specific process fluids in semiconductor and electronics manufacturing to the compatible filter membrane material, recommended micron rating range and the key reason for the material selection. Where multiple membranes are shown as compatible, the preferred choice depends on the required extractables level and flow rate for the specific application.
| Process Fluid | Compatible Membrane | Rating Range | Incompatible Materials | Key Selection Reason |
|---|---|---|---|---|
| UPW / DI Water (point-of-use) | PTFE, PES, Nylon 66 | 0.01–0.05 µm | Polypropylene (TOC extractables) | Ultra-low TOC and particle count — PES preferred for high flow; PTFE for acid-rinse compatible installations |
| HF, Buffered HF (BHF) | PTFE, PFA only | 0.05–0.2 µm | PES, Nylon, Polypropylene, PVDF at high HF conc. | HF attacks virtually all polymers except PTFE and PFA — membrane degradation produces contamination and causes filter failure |
| H₂SO₄, Piranha (H₂SO₄/H₂O₂) | PTFE only | 0.05–0.2 µm | All others — oxidising chemistry damages most polymers | Concentrated H₂SO₄ and Piranha are strongly oxidising — only PTFE provides adequate chemical resistance and safety |
| NH₄OH, SC-1 (NH₄OH/H₂O₂) | PTFE, PFA, PVDF | 0.05–0.2 µm | Nylon (hydrolyses in alkaline), PES (limited alkaline resistance) | High pH + H₂O₂ oxidiser — PTFE/PFA preferred; PVDF acceptable at moderate concentration |
| Photoresist (positive/negative, EUV CAR) | Nylon 66, PTFE, PFA | 0.02–0.05 µm | PES, PVDF (high extractables in resist solvents) | EUV CAR lithography requires ultra-low extractables — Nylon 66 preferred for low extractables in organic solvent carriers; PFA for highest purity |
| TMAH Developer | PTFE, PVDF | 0.05–0.1 µm | Nylon (alkaline hydrolysis), PES (limited alkaline stability) | TMAH is a strongly alkaline organic base — Nylon degrades in TMAH service; PTFE and PVDF are compatible |
| IPA / Organic Solvents | PTFE, PVDF, Nylon 66 | 0.02–0.1 µm | PES (limited solvent resistance) | IPA, acetone and organic solvent circuits — PTFE preferred for broadest solvent compatibility; Nylon acceptable for IPA-only service |
| CMP Slurry (Oxide / Dielectric) | PVDF, Polypropylene (depth) | 1–3 µm depth | Membrane filters — block working abrasive | Requires depth filtration with graded density — membrane filters remove working abrasive at the required cut-point |
| CMP Slurry (Metal / Barrier) | PVDF (tangential-flow) | 0.5–1 µm TFF | Standard depth filters — insufficient selectivity | Narrow oversize/working-abrasive size differential requires crossflow selectivity — tangential-flow PVDF membrane preferred |
Semiconductor Process Effluent Treatment — Filtration's Role in Wastewater Management
Semiconductor facilities generate several distinct wastewater streams that require treatment before discharge. Filtration is integral to the treatment process — both as pre-filtration to protect treatment equipment and as post-treatment polishing to meet discharge quality standards. For facilities implementing water recycling programmes to reduce freshwater consumption, filtration is the primary technology enabling treated effluent to meet the purity requirements for reuse.
Treatment Stage 1 Acid/Alkali Neutralisation
Acid waste streams (HF, H₂SO₄, HCl from wet bench overflows) and alkali waste streams (NH₄OH, TMAH developer) are segregated at source and neutralised separately before combining. Pre-filtration at 10–25 µm removes chemical precipitates that form when mixed acid-alkali streams are partially neutralised — these solids would otherwise clog neutralisation reactor vessels and pH sensors.
HF waste receives special treatment: fluoride ions must be precipitated as calcium fluoride (CaF₂) by adding calcium hydroxide before neutralisation, and the resulting CaF₂ sludge is removed by sedimentation and filtration before the treated water continues to the drain. This is a regulatory requirement under Thai industrial effluent standards for facilities processing HF.
Treatment Stage 2 CMP Slurry & Particulate Removal
CMP drain effluent contains colloidal silica, alumina or ceria abrasive particles from the spent slurry, chemical residues from the polishing chemistry and metal ions dissolved from the wafer surface during polishing. This stream cannot be combined with acid/alkali waste without pre-treatment — the colloidal particles would foul the neutralisation system and the metal ion content may require separate treatment.
Pre-filtration at 5–10 µm in PVDF or polypropylene removes the coarse slurry fraction; the colloidal fraction requires coagulation and flocculation before filtration can remove it. For facilities with copper or other metal CMP, the filtrate must be tested for dissolved metal content — if metals exceed discharge limits, ion exchange or chemical precipitation and filtration is required before discharge.
Treatment Stage 3 DI Water Recovery & Reuse
Semiconductor facilities using large volumes of ultrapure water — particularly in HDD manufacturing, wafer cleaning and display panel washing — increasingly implement water recycling to reduce freshwater intake and wastewater discharge volumes. Treated rinse water effluent, after neutralisation and primary treatment, can be polished through a secondary purification train for reuse as process water or cooling water makeup.
Membrane filtration at 0.1–0.2 µm as part of the recycling loop removes bacteria and remaining particulates from treated effluent before it enters an ion exchange or reverse osmosis system to restore resistivity. Recovered water can typically achieve 1–5 MΩ·cm resistivity, suitable for non-critical rinsing, cooling tower makeup or equipment cleaning — significantly reducing the facility's freshwater consumption and discharge permit requirements.
Standards & Compliance
SEMI F57 SEMI S2 SEMI F63 ISO 14644 ISO 8573-1 IPC Standards Thai Industrial Effluent Standards
Design Your Semiconductor Process Filtration System
Our process filtration engineers will map every fluid stream in your semiconductor or electronics facility, select the correct filter media and micron rating for each position, and design a complete process filtration system from UPW point-of-use through to effluent pre-treatment.
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